Industries We Serve
Comprehensive materials and device analysis supporting semiconductor, defense, automotive, medical, and research applications.
Industries Served
Each service we industry leverage our core capabilities:
Hitachi SU3500 SEM with EDS for imaging and elemental analysis, Allied MultiPrep for precision polishing, and Allied TechCut for accurate sectioning.
SEMICONDUCTOR MANUFACTURING
Supporting semiconductor companies with:
- Failure analysis using SEM/EDS imaging
- Cross-sectional analysis of packaged devices
- Wire bond and die attach inspection
- Contamination identification
- Metallization and passivation layer examination
DEFENSE & AEROSPACE
ITAR-compliant analytical services:
- Component cross-sectioning for authenticity verification
- Reverse engineering support for obsolete parts
- Failure analysis of military-grade components
- Materials composition verification using EDS
- High-resolution imaging of suspect devices
AUTOMOTIVE ELECTRONICS
Materials analysis support:
- Power device cross-sectioning
- Solder joint inspection
- Failed component investigation
- Contamination analysis
- Wire bond failure documentation
MEDICAL DEVICES
Analytical services for medical electronics:
- Precision cross-sectioning of hermetic packages
- Contamination and foreign material analysis
- High-resolution imaging of critical components
- Materials verification using EDS
RESEARCH & DEVELOPMENT
Supporting university and corporate R&D:
- Novel material characterization
- Device structure analysis
- Prototype failure investigation
- High-resolution microscopy services
- Precision sample preparation for research
MATERIALS RESEARCH
Advanced materials characterization:
- Composite material cross-sectioning
- Particle size and morphology analysis
- Coating thickness measurement
- Interface and adhesion evaluation
- Microstructural analysis