Laboratory Services

Our facility combines state-of-the-art analytical equipment with deep technical expertise to support failure analysis, materials characterization, and product development across multiple industries.

Materials Analysis

  • Scanning Electron Microscopy (SEM)

    Scanning Electron Microscopy (SEM) High-resolution imaging and analysis using Hitachi SU3500 with variable pressure capabilities:

    • Secondary electron imaging (SEI) for surface topography
    • Backscattered electron imaging (BSE) for compositional contrast
    • 2-3nm resolution at 30kV
    • Large chamber accommodating samples up to 200mm

  • X-Ray Spectroscopy (EDS)

    Oxford Instruments Inca X-MAX^N Energy Dispersive X-Ray Spectroscopy (EDS) Elemental composition analysis and mapping:

    • Qualitative and quantitative elemental analysis
    • Line scans and area mapping
    • Contamination identification
    • Layer composition verification

Sample Preparation

    Precision Cross-Sectioning

    Precision Cross-Sectioning Critical for internal structure examination:

    • IC package cross-sections
    • Wire bond inspection
    • Die attach evaluation
    • Solder joint analysis
    • Via and interconnect examination

  • Metallographic Preparation

    Metallographic Preparation Utilizing Allied MultiPrep 8″ system:

    • Parallel polishing to sub-micron accuracy
    • Angle polishing for specific features
    • Chemical-mechanical polishing (CMP)
    • Final ion milling preparation available through partners

  • Precision Sectioning

    Precision Sectioning Allied TechCut 4x capabilities:

    • Low-speed diamond sawing
    • Minimal mechanical stress
    • Precise targeting of areas of interest
    • Sample sizes up to 4″ x 4″

Failure Analysis

  • Electronic Component Investigation

    Electronic Component Investigation Systematic failure analysis approach:

    • Non-destructive examination
    • Electrical verification
    • Package decapsulation
    • Die-level inspection
    • Root cause determination

  • Failure Mode Analyzation

    Common Failure Modes Analyzed:

    • Wire bond failures
    • Die attach delamination
    • Passivation defects
    • Metallization issues
    • ESD/EOS damage
    • Contamination-related failures

  • Advanced Analytical Techniques

    Analytical Techniques:

    • Optical microscopy
    • SEM/EDS analysis
    • Cross-sectional analysis
    • Surface analysis
    • Elemental mapping